𝐘𝐆𝐋 𝐒𝐡𝐨𝐰𝐜𝐚𝐬𝐞𝐬 𝐒𝐦𝐚𝐫𝐭 𝐒𝐨𝐥𝐮𝐭𝐢𝐨𝐧𝐬 𝐚𝐭 𝐀𝐝𝐯𝐚𝐧𝐜𝐞𝐝 𝐄𝐥𝐞𝐜𝐭𝐫𝐨𝐧𝐢𝐜 𝐏𝐚𝐜𝐤𝐚𝐠𝐢𝐧𝐠 𝐖𝐨𝐫𝐤𝐬𝐡𝐨𝐩

𝐘𝐆𝐋 𝐒𝐡𝐨𝐰𝐜𝐚𝐬𝐞𝐬 𝐒𝐦𝐚𝐫𝐭 𝐒𝐨𝐥𝐮𝐭𝐢𝐨𝐧𝐬 𝐚𝐭 𝐀𝐝𝐯𝐚𝐧𝐜𝐞𝐝 𝐄𝐥𝐞𝐜𝐭𝐫𝐨𝐧𝐢𝐜 𝐏𝐚𝐜𝐤𝐚𝐠𝐢𝐧𝐠 𝐖𝐨𝐫𝐤𝐬𝐡𝐨𝐩
Global Electronics Association (GEA) Advanced Electronic Packaging Consortium Workshop

12th November 2025 – YGL successfully participated as an exhibitor at the Global Electronics Association (GEA) Advanced Electronic Packaging Consortium Workshop, which was held in Penang, Malaysia. The event’s theme, “Addressing integration challenges,” aligns perfectly with the strategic digital transformation needs of the electronics manufacturing sector.

Focus of YGL’s Participation

YGL leveraged this key industry event to showcase its leading Enterprise 4.0 solutions, which are critical for manufacturers navigating the shift toward advanced packaging, Heterogeneous Integration, and System-in-Package (SiP) solutions.

Key elements of their exhibition likely included:

Smart Manufacturing: Demonstrating how their solutions integrate IoT, automation, and real-time data to optimize production efficiency and synchronize supply-demand processes, which is vital for the precise and complex nature of advanced packaging assembly.

Smart Warehouse Solutions: Highlighting the competitive advantages gained through automated, data-driven warehouse management, which ensures speed, accuracy, and inventory control for sensitive electronic components and substrates.

ESG Middleware: Showcasing their newly developed middleware for Environmental, Social, and Governance (ESG) reporting, which helps manufacturers meet increasing investor and regulatory pressure for sustainability and traceability in their complex supply chains.

Strategic Importance

YGL’s presence underscored their commitment to supporting the local and global electronics supply chain, particularly in Malaysia’s strong manufacturing ecosystem (often supported by partners like Invest Penang and MIDA). By engaging directly with government officials, industry experts, and peers, YGL reinforced its position as an essential Industry 4.0 solution provider helping manufacturers achieve higher levels of efficiency, cost savings, and a competitive edge in the advanced electronics packaging space.

This participation marks YGL’s ongoing dedication to being at the forefront of digital transformation in the electronics and semiconductor industry.

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